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Attributes of high?performance power module packaging

Attributes of high?performance power module packaging image

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From the first Brick to today’s ChiP™ (Converter housed in Package), Vicor has been continually innovating to deliver higher?performance solutions to power?system engineers. These innovations are a result of a steadfast focus on advancing four essential technology pillars: power delivery architectures, control systems, topologies and packaging.

The fourth pillar, power module packaging, has been a unique differentiator for Vicor since its inception. There are several attributes that enable a high?performance power module package, and Vicor consistently leads the industry in advancing each one: high power and current density, thermal adeptness, integrated magnetics, compatibility with high?volume PCB assembly techniques along with automated and scalable high?volume manufacturing.